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RT9718BGQW过压过流保护芯片OVP保护IC_百度文库https://wenku.baidu.com/view/ac6e4836fbd6195f312b...Translate this page过压过流保护芯片:RT9718BGQW 联系人:王先生 18118778115 QQ:1287023195 RT9718 Over Voltage Protection IC General Description The RT9718 is an integrated circuit optimized to protect low voltage system from abnormal high input voltage (up …

过压过流保护芯片:RT9718BGQW 联系人:王先生 18118778115 QQ:1287023195 RT9718 Over Voltage Protection IC General Description The RT9718 is an integrated circuit optimized to protect low voltage system from abnormal high input voltage (up …
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High Freq Multi-Layer HighQ Capacitors | Johanson …https://www.johansontechnology.com/high-q-multi-layer-capacitorsThese lines of Multi-Layer High-Q Capacitors, HiQ MLCC, HiQ Capacitors, SMT Capacitors, Low ESR Capacitors and Low Loss Capacitors have been developed for High-Q and microwave applications.

These lines of Multi-Layer High-Q Capacitors, HiQ MLCC, HiQ Capacitors, SMT Capacitors, Low ESR Capacitors and Low Loss Capacitors have been developed for High-Q and microwave applications.
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FAILURE MECHANISM BASED STRESS TEST

AEC - Q100 - REV-G May 14, 2007 Component Technical Committee Automotive Electronics Council TABLE OF CONTENTS AEC-Q100 Failure Mechanism Based Stress Test Qualification for Integrated Circuits
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Chip-scale package - Wikipediahttps://en.wikipedia.org/wiki/Chip-scale_packageA chip scale package or chip-scale package (CSP) is a type of integrated circuit package.. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging.According to IPC's standard J-STD-012, Implementation of Flip Chip and …

A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging.According to IPC's standard J-STD-012, Implementation of Flip Chip and …
en.wikipedia.org/wiki/Chip-scale_package

貼片電感器 射頻電感 功率電感 繞線電感 陶瓷電感 疊層 …www.token.com.tw/big5/inductors.htmTranslate this page德鍵電子運用最新的技術,使得設計製造電感器的成本降低,效益大幅提高。0402,0603,0805,1206,1210,1812 系列的微型射頻電感器,包含線繞及積層式,陶瓷或鐵氧體磁芯材料的技術。

德鍵電子運用最新的技術,使得設計製造電感器的成本降低,效益大幅提高。0402,0603,0805,1206,1210,1812 系列的微型射頻電感器,包含線繞及積層式,陶瓷或鐵氧體磁芯材料的技術。
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Inductors & Coils - Token Componentstoken.com.tw/inductors.htmToken Inductor Manufacturer - Inductors & Coils meet RoHS requirements, include RF Chip Inductors, RF Wirewound Inductors, RF Thin Film Inductors, Multilayer Inductors, Through Hole Inductors, Power Inductors, Toroidal Coils, Choke Coils, SMD Wirewound Inductors, Shielded Inductors, Unshielded Inductors, SMD Balun Transformers, EMI …

Token Inductor Manufacturer - Inductors & Coils meet RoHS requirements, include RF Chip Inductors, RF Wirewound Inductors, RF Thin Film Inductors, Multilayer Inductors, Through Hole Inductors, Power Inductors, Toroidal Coils, Choke Coils, SMD Wirewound Inductors, Shielded Inductors, Unshielded Inductors, SMD Balun Transformers, EMI …
token.com.tw/inductors.htm

Document Revision Table | IPCwww.ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htmProduct ID: Document Name: Responsible Committee: Status: DoD: J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies : 5-22a: Rev G 10/17

Product ID: Document Name: Responsible Committee: Status: DoD: J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies : 5-22a: Rev G 10/17
www.ipc.org/4.0_Knowledge/4.1_Standards/revstat1.h...

IPCblog.naver.com/PostView.nhn?blogId=skyu0021&logNo=...Translate this page"wohrle사의 제품으로 입력 키패드 오동작 및 보드,시스템 오작동의 시스템 1대 브라운관 모니터 백화현상 1대--- 모니터 교체 필요

"wohrle사의 제품으로 입력 키패드 오동작 및 보드,시스템 오작동의 시스템 1대 브라운관 모니터 백화현상 1대--- 모니터 교체 필요
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Automotive dual-line Transil , transient voltage ...

Characteristics ESDCAN01-2BLY, ESDCAN24-2BLY 2/10 DocID027996 Rev 1 1 Characteristics Table 1. Absolute maximum ratings (T …
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